AMD Ryzen Z3 specs leak points to handheld chip redesign
AMD is reportedly prepping new Ryzen Z3 processors for gaming handhelds, with a notable redesign. Leaks suggest a chip with six cores—four high-performance Zen 6 and two low-power cores—and integrated RDNA 4m graphics with up to 12 compute units. It will use AMD's compact 25x25 mm FF6 package, shrinking the footprint for portable devices. Two versions are planned, optimized for either 15W or 25W power. All details are based on unconfirmed leaks.
- Six-core CPU: four Zen 6 plus two low-power cores
- 12 RDNA 4m integrated GPU compute units rumored
- Designed for tiny 25x25 mm FF6 chip package
- Standard and 'Extreme' versions at 15W and 25W power targets
- Specs not officially confirmed by AMD
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