China to debut advanced DDR5 memory chip by year-end
China’s memory chipmaker CXMT says it will launch DDR5 chips using advanced hybrid bonding and 4F² stacking by the end of this year. That would beat out Samsung’s anticipated 2028 debut with this tech. CXMT’s move highlights China’s fast progress in standard chip types, though Elon Musk argues that more complex memory architectures like 3D stacking will be harder for China to master.
- CXMT plans 4F² DDR5 chips launch in late 2024
- Samsung's comparable product expected by 2028
- 4F² tech increases chip density by stacking vertically
- Elon Musk doubts China can scale 3D stacking as fast
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