Nvidia shares Vera Rubin AI rack designs with OCP
Nvidia is opening up its latest Vera Rubin rack and compute tray designs for AI data centers, contributing them to the Open Compute Project (OCP). The updated setup relies on modular, liquid-cooled components with no cables, hoses, or fans inside the trays, designed to pack more compute into the same space and speed up assembly. The design's now available for industry partners to adopt and scale on their own.
- Nvidia shares modular rack and tray designs with OCP
- Compute trays have no internal cables, hoses, or fans
- Liquid-cooled 5,000A busbar enables denser systems
- Partners can now build on this open, scalable architecture
Sources covering this
In this story
More in Chips
Microsoft unveils Maia 300 AI chip, plans to scale deployments
Microsoft just unveiled its Maia 300 AI chip, the third version of its in-house silicon, and said it will shift most of its AI services…
AMD unveils Helion rack for agentic AI with up to 32,768 cores
AMD just announced the Helion rack, a new open design for building AI server systems.
Intel launches D-Series AI GPUs with up to 1.3 PFLOPS
Intel has officially named its Crescent Island chip the D-Series GPU and revealed new technical specs.
Nvidia and Cisco announce ultra-dense 400Gb/s USFP optical modules
Nvidia and Cisco unveiled a new optical module called USFP, designed to deliver 400Gb/s per lane and up to 12.8Tb/s of network capacity.