Semiconductor substrates get complex and specialized
Semiconductor substrates—the base layers connecting chip components—are getting more complicated and specialized. Packages for AI and servers now need bigger, multi-layered, custom substrates that can’t be swapped between suppliers, meaning you can’t just solve shortages by ramping up the old way. This extra complexity drives up costs even though the number of packages shipped isn’t rising, and the whole packaging process has to adapt.
- AI and server chips need larger, multi-layer substrates
- Substrate supply is now a capability problem, not just volume
- Higher costs without matching increase in shipments
- Suppliers’ substrates are less interchangeable than before
Sources covering this
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