Huawei's LogicFolding chip tech faces heat dissipation doubts

Huawei says its new LogicFolding chip tech, found in the Kirin 9050 Pro, can cut clock buffer usage by half, potentially lowering power needs. But a semiconductor expert argues the stacked design still traps too much heat, limiting overall performance. Both Qualcomm and Apple have reportedly declined to use LogicFolding, citing these thermal issues. Even with Huawei's claims, the expert thinks it won't match top manufacturing methods till 2030.

• LogicFolding claims to halve clock buffer requirements
• Stacked chip design increases compute density
• Expert warns heat dissipation is still a problem
• Qualcomm and Apple show no interest in the tech
• Parity with leading chipmakers may be years away