New chip research covers sub-5nm transistors, Rowhammer GPUs

A roundup highlights new semiconductor research, including a wafer-scale sub-5 nanometer molybdenum disulfide (MoS₂) transistor, techniques for multi-kilowatt power delivery in advanced 3D integrated chips, potential Rowhammer vulnerability attacks on GPUs, and agent-assisted chip design using high-level synthesis. The compilation also covers copper microstructure and stress in through-silicon vias, RTL Trojan detection methods, and memory access strategies for large AI models.

• Wafer-scale sub-5nm MoS₂ transistors explored
• Rowhammer GPU attacks analyzed as a security risk
• Agent-driven chip design with high-level synthesis featured
• 3D integrated chip power delivery techniques detailed