Chip manufacturers push for better defect detection

Chip manufacturers are facing tougher challenges as advanced packaging techniques make it harder to spot defects before chips are fully assembled. New processes stack components in layers, and a single missed flaw can waste an expensive build. To avoid this, manufacturers are combining multiple inspection and measurement methods, using 2D, 3D, and infrared imaging to spot everything from surface particles to hidden voids—without slowing production. Spotting smaller, trickier flaws is now essential for ramping up yield in next-gen chips.

• Defects hidden in chip stacks are now harder to detect
• Inspection must catch both surface and subsurface flaws
• Missing a defect late in production risks losing high-value assemblies
• Manufacturers use 2D, 3D, and infrared inspection together
• Faster, more sensitive tools aim to avoid bottlenecks