GlobalFoundries inks $2B deal to make TSMC packaging parts in US
GlobalFoundries will manufacture silicon interposers—key parts for advanced chip packaging—for TSMC in the US under a $2 billion, five-year deal. This lets TSMC’s customers label their products as fully made and packaged in America. High-volume production is expected to start in the first half of 2028, establishing a domestic supply of critical packaging materials.
- Five-year agreement worth $2 billion
- GlobalFoundries to make silicon interposers for TSMC
- Focuses on advanced chip packaging tech
- Production set to ramp up in H1 2028
- Supports "made in America" claims for end products
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