Plasma emerges as alternative to KOH for LCP metallization
A new study shows plasma processing can prep liquid crystal polymer (LCP) surfaces for copper plating as well as traditional KOH chemical treatment. Plasma's surface activation and roughening matches KOH's results without needing hazardous chemicals or specialized process lines. Trials using Nordson’s MaxVIA system confirmed effective roughening, strong copper adhesion, and no leftover residue—covering even thicker LCP boards. Plasma could simplify LCP manufacturing for electronics and medical devices.
- Plasma process equals KOH in surface roughening.
- No hazardous alkaline chemicals needed.
- Works on thicker LCP boards used in demanding tech.
- Nordson’s MaxVIA system proved process reliability.
Sources covering this
More in Chips
GlobalFoundries inks $2B deal to make TSMC packaging parts in US
GlobalFoundries will manufacture silicon interposers—key parts for advanced chip packaging—for TSMC in the US under a $2 billion,…
AMD, Samsung in talks over AI chip memory supply
AMD CEO Lisa Su visited Samsung in Seoul to secure more high-bandwidth memory (HBM) needed for AMD’s AI accelerators, according to…
Samsung high on AI chip demand, forecasts record $80B profit
Samsung says its third-quarter operating profit will jump to 107.4 trillion won—about $80 billion—thanks to soaring demand for memory…
AMD bringing FSR 4 upscaling to APUs and handhelds this year
AMD says its FSR 4 upscaling—machine learning tech that boosts gaming performance—will roll out to APUs (processors with built-in…